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The paste she has created is based on dispersed carbon black (a particulate form of industrial carbon used to reinforce rubber) mixed in a soup of ethyl cellulose and polyethylene glycol. In tests comparing it to solder (a method of thermal transfer not typically used with electronic components because of the temperature required to bond it to both surfaces), the carbon paste surpassed the pure metal bond in thermal conductivity by 33%. It was also superior to diamond and carbon nanotube based pastes currently undergoing development. Even if the carbon paste were to merely match the diamond and nanotube pastes, it would be a significant improvement because of the cost differences.